化学芯片开封机 Elite Etch Cu 7100

化学芯片开封机 Elite Etch Cu 7100The first acid decapsulator made for copper

RKD Elite Etch蚀刻酸解封装置集成了许多的工程创新。采用优质级碳化硅加工的整体式蚀刻头组件具有优异的耐酸性，再加上活性氮气体监测和净化系统这一整体的设计，降低了开封完成后残留在蚀刻头上酸的冒烟情况。选择单片碳化硅也可以缩短升温时间。

蚀刻头使用低热质量的设计。其他制造商使用高热质量设计和复杂可互换的组件如可移动的蚀刻头插入，具有不可靠的性能特点。我们简单但有效的设计大大减少了蚀刻头的清洗和周围堵塞的情况。

设备限制鼻压头是手动下压，是专为大量的使用所设计。鼻压头通常缩回，只在安全盖完全关闭后延伸。RAM的鼻子垂直运动的固定装置的蚀刻头从而消除或包或夹具的运动。
 

The Elite Etch Cu 7100 improves upon the design of the Elite Etch 7000 by incorporating a rapid heating and cooling system. Using a thermal exchanger directly contacting the etch head and acid lines, sulfuric acid decapsulation rate is accelerated to reduce overall volume usage. A precise acid temperature combined with a high delivery rate allows decapsulation of copper wired devices with no wire or metallization damage. The specially designed acid heat exchanger can accurately control the acid temperature between 10° and 250° C with flow rates of up to 8 ml per minute. The high acid pulse rates allow for reasonable etch times even at the lowest temperatures.

The Elite Etch Cu features an acid controller etch head which is machined from premium grade silicon carbide for unsurpassed acid resistance. The etch head is designed to reduce the fuming of any residual acids left on the etch head at the end of the process, both for operator safety and convenient acid disposal.

The device hold-down assembly (ram nose) is a pneumatically activated push rod. The ram nose is normally retracted and extends when the safety cover is fully closed. The ram nose secures the sample package and a definition gasket to the etch head, thus eliminating movement of either the package or its fixturing.

RKD Engineering incorporates double containment for all fluid couplings between the bottle container and the decapsulator. The bottle box assembly and the etcher unit both contain fluid sensors to alert the operator in the event of an acid leak from any of the bottles or internal fittings. The bottle box incorporates a universal pivoting interconnect which allows simple bottle exchange with minimal exposure to residual acid.

Specifications

Etcher Unit	Height: 300 mm (13 in)
	Width: 190 mm (7.5 in)
	Depth: 305 mm (12 in)
Bottle Assembly	Height: 254 mm (10 in)
	Width: 280 mm (11 in)
	Depth: 127 mm (5 in)
Weight	Approx. 16 kg (35 lb)
Power Source	90 to 250 VAC, 50 to 60 Hz (4 amp)
Acid temp. range	10° to 250° C
Acid temp. set point	1° C ± 1% of setting
Etch cavity (up to)	22 mm x 22 mm (30 mm diagonal)
Choice of Acids	fuming nitric acids, mixed fuming nitric and sulfuric acids, or fuming/concentrated sulfuric acid
Acid Mix Ratios	(nitric to sulfuric ratios) 9:1, 6:1, 5:1, 4:1, 7:2, 3:1, 5:2, 2:1, 3:2, 1:1, 1:2, 1:3, 1:4, 1:5
Post Etch Rinse Options	sulfuric acids, fuming nitric acids, mixed acids, or no rinse
Etch Times	1 to 2,400 seconds in 1 second increments (1 seconds to 40 minutes) dynamic (real time) adjustments of etch time
Etchant Volume Selection	1 to 8 ml per minute - for all acids & acid mixes
Etch Delivery Functions	pulsed or Reciprocal Etch Acid Pulse (REAP) for lower acid consumption
Operator Program Storage	100 programs stored to nonvolatile memory
Warranty	most comprehensive and inclusive warranty in industry (ask for full details)

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