XP Precision Sectioning Saw and Diamond Sectioning / Wafering Blades
金刚石切片/晶圆刀片
| XP Precision Sectioning Saw, each | |
Diamond Sectioning / Wafering Blades
Can be used on all popular precision sectioning and cutting saws from PELCO, Buehler, LECO, Struers, Allied and many others.
These competitively priced Smart Cut™ precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life. The man-made diamond crystals in the Smart Cut™ diamond sectioning blades / wafering blades are oriented in such a way that diamonds are only activated at the exposed layer. As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.
金刚石切片/晶圆刀片
可用于PELCO,Buehler,LECO,Struers,Allied等众多流行的精密切片和切割锯。
这些价格具有竞争力的Smart Cut™精密金刚石切片刀片旨在提供的光滑表面质量,低失真切片和增强的刀片寿命。 Smart Cut™金刚石切片刀片/切片刀片中的人造金刚石晶体的取向使得钻石仅在暴露层处被激活。 随着暴露层开始磨损,新层中的钻石被激活,从而保持切割速度。
The advantages are:
- Faster cutting action – leaves smooth finish
- Less glazing – requires minimal dressing
- More universal – compatible with a greater variety of materials
优点是:
更快的切割动作 - 留下光滑的表面
减少上釉 - 需要Z少的修整
更通用 - 与更多种材料兼容
All Smart Cut™ diamond blades have a metal bonded diamond height of 4mm and are available in 3, 4, 5 & 6" diameter with the industry standard 1/2" or 5/8" arbor holes. Three grades are offered to fit most applications:
所有Smart Cut™金刚石刀片均采用金属粘合金刚石高度4mm,直径为3,4,5和6英寸,采用行业标准1/2英寸或5/8英寸刀杆孔。提供三种等级以适应大多数应用:
- LC200MF medium/fine grit – low concentration for hard and tough materials, hard coating, hard ceramics and concrete ( equivalent to Buehler 15LC)
- HC150MC medium/coarse grit - high concentration for composite materials, PCB, soft metals and bone (equivalent to Buehler 15HC)
- HC320F fine grit – high concentration for glass fiber and carbon composites, soft ceramics and optical materials (equivalent to Buehler 5LC and 10LC)
LC200MF中/细砂 - 低浓度,适用于坚硬和坚硬的材料,硬涂层,硬质陶瓷和混凝土(相当于Buehler 15LC)
HC150MC中/粗砂 - 高浓度复合材料,PCB,软金属和骨(相当于Buehler 15HC)
HC320F细砂 - 高浓度玻璃纤维和碳复合材料,软陶瓷和光学材料(相当于Buehler 5LC和10LC)
1/2" Arbor Hole for Buehler, Struers, Allied and many others |
| Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, medium/fine grit - low concentration | |
| Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, medium/coarse grit - high concentration | |
| Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, fine grit - high concentration | |
| Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/fine grit - low concentration | |
| Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/coarse grit - high concentration | |
| Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, fine grit - high concentration | |
| Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/fine grit - low concentration | |
| Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/coarse grit - high concentration | |
| Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, fine grit - high concentration | |
| Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/fine grit - low concentration | |
| Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/coarse grit - high concentration | |
| Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, fine grit - high concentration | |
5/8" Arbor Hole for PELCO XP-300, PELCO CS600A and PCS-400 |
| Diamond Wafering Blade, 3" x 0.010" x 5/8" hole, medium/fine grit - low concentration | |
| Diamond Wafering Blade, 3" x 0.010" x 5/8" hole, medium/coarse grit - high concentration | |
| Diamond Wafering Blade, 3" x 0.010" x 5/8" hole, fine grit - high concentration | |
| Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/fine grit - low concentration | |
| Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/coarse grit - high concentration | |
| Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, fine grit - high concentration | |
| Diamond Wafering Blade, 5" x 0.015" x 5/8" hole, medium/fine grit - low concentration | |
| Diamond Wafering Blade, 5" x 0.015" x 5/8" hole, medium/coarse grit - high concentration | |
| Diamond Wafering Blade, 5" x 0.015" x 5/8" hole, fine grit - high concentration | |
| Diamond Wafering Blade, 6" x 0.020" x 5/8" hole, medium/fine grit - low concentration | |
| Diamond Wafering Blade, 6" x 0.020" x 5/8" hole, medium/coarse grit - high concentration | |
| Diamond Wafering Blade, 6" x 0.020" x 5/8" hole, fine grit - high concentration | |
| Diamond Blade for ceramics, composites, 6 x 0.019 x 5/8" hole | |
| Diamond Blade for geological use, 6 x 0.020 x 5/8" hole | |
| Borazon Blade for Nickel and Cobalt alloys, 6 x 0.019 x 5/8" hole | |
cutting fluid, soluble oil (recommended)
SO type, water base, anti corrosive, mix 1:40 water
| Cutting Fluid, Soluble Oil | |
| Cutting Fluid, Soluble Oil | |
Cutting Fluid, Non-soluble Oil
| Cutting Fluid, Non-soluble Oil | |
Dressing Sticks
| Dressing Sticks for Abrasive Blades | |
| Dressing Sticks for Diamond Blades | |