16007 Silicon Chip Supports硅芯片样品支持

Si-chips are opaque, of low electrical resistance and have surface properties equal to glass （including smoothness）. They are chemically inert and make good substrates for growing or mounting cells. Si-chips are precleaned before packaging. Also ideal for imaging small particles due to low background signal.

Availability: 4" wafer is precut into 5x7mmm, 5x5mm or 10x10mm chips that can be easily separated in the laboratory.

硅芯片样品支持

Si芯片是不透明的，具有低电阻并且具有与玻璃相同的表面特性（包括光滑度）。 它们具有化学惰性，是生长或安装细胞的良好基质。 Si芯片在包装前进行预清洗。 也适用于由于低背景信号而成像小颗粒。

供货情况：4“晶圆预切成5x7mmm，5x5mm或10x10mm芯片，可在实验室中轻松分离。

• 4" wafer precut into 5x7mm chips, approximay 187 chips/wafer
• 4" wafer precut into 5x5mm chips, approximay 270 chips/wafer
• 4" wafer precut into 10x10mm chips, approximay 55 chips/wafer   Properties:
  Orientation （111）
  Resistance 1-30 Ohms
  Type P （Boron） （1 primary flat）
  No SiO₂ top coating
  Wafer thickness is 18-21 mil
  Wafer is polished on one side
  After dicing they are rinsed in DI water for cleaning
• 4“晶圆预切成5x7mm芯片，接近187芯片/晶圆
  4“晶圆预切成5x5mm芯片，近似270个芯片/晶圆
  4“晶圆预切成10x10mm芯片，近似55芯片/晶圆属性：
  方向（111）
  电阻1-30欧姆
  P型（硼）（1个主扁平）
  没有SiO2顶涂层
  晶圆厚度为18-21密耳
  晶圆在一侧抛光
  切割后，将它们在去离子水中冲洗以进行清洁

• Prod #	Description	Unit

  16007

  4" （10cm） dia., 5x7mm diced Silicon Wafer, 187 chips/wafer,

  each

  16008

  4" （10cm） dia., 5x5mm diced Silicon Wafer, 270 chips/wafer

  each

  16006

  4" （10cm） dia., 10x10mm diced Silicon Wafer, 55 chips/wafer

  each

Silicon Chip Specimen Supports