813-206 Silicone Mold Release硅胶脱模剂

This superior formulation of silicon mold release is particularly useful for easy release of cold or hot embedding molds. Cured resin embedding can be easily removed from plastic embedding mold when a thin layer of silicon mold release is sprayed on the inside of the mold. Apply a thin coat before loading sample and embedding powder （phenolic, lucite, epoxy or diallyl phatalate） in hot embedding presses. Also prevents sticking of materials such as plastics, rubber and waxes to molds. Contains no CFC, HCFC or chlorinated solvents.
Temperature Range: 40°F to 500°F （5°C to 260°C）.