High speed lithography without mask by adopting the sub-micron laser spot.Light source : fs laser [second, third and fourth harmonic wave selectable]Stages : non-contact air bearing stage or high speed linear motor stage selectableOptical observation system: coaxial optical unit monitoring for process condition.Auto focus : High speed and fine beam scanning system.Direct laser processing using DXF file, which can be generated by most CAD system.Three-dimensional deep cutting, XY axis’ repeatable processing.High speed scanning processing in visible range size.Applicable range for 6 inches to 300mm wafer.(applicable for longer size) |