Omniprobe 聚焦离子束载网FIB半分载网 Lift-Out Grids
Omniprobe聚焦离子束载网专为聚焦离子束切割仪或聚焦离子束/透射电镜系统的电镜切片准备。载网的典型厚度为25-30um,直径3mm。中间的小柱设计用来保持的接触和为片层样品粘附(焊接)提供安全区域。这些聚焦离子束载网适合于标准的透射电镜载网夹并且可以直观的看到粘附于小柱的剖面。
载网主要应用于离子刻蚀。在离子束下不干扰EDS的X射线峰,对样品可起到良好的保护作用。
The Omniprobe® Lift-Out Grids are specifically designed to accept the TEM lamellas milled out by FIB or SEM/FIB systems. Typical thickness of the grids is 25-30µm with a diameter of 3mm. The posts are designed for optimum access and provide a secure area for attaching (welding) the lamella(s). The Omniprobe grids fit standard TEM holders and provide a non-obscured view of the thin sections attached to the posts.
Description | Unit |
Omniprobe Lift-Out Grids, Cu with 3 posts | pkg/100 |
Omniprobe Lift-Out Grids, Cu with 3 posts, shallow downset | pkg/100 |
Omniprobe Lift-Out Grids, Mo with 3 posts | pkg/25 |
Omniprobe Lift-Out Grids, Cu with 3 posts and side access | pkg/100 |
Omniprobe Lift-Out Grids, Cu with 4 posts | pkg/100 |
Omniprobe Lift-Out Grids, Mo with 4 posts | pkg/25 |
Omniprobe Lift-Out Grids, Cu with 5 posts | pkg/100 |
Omniprobe Beryllium Half Ring Grids, Be | pkg/10 |
GSB-100 Storage Box for 100 Omniprobe grids, complete with base, lid and clips | each |