125-22丝网印刷B级导电低CTE环氧粘合剂

125-22丝网印刷B级导电低CTE环氧粘合剂

说明

125-22是一种可丝网印刷的B级导电单组分环氧粘合剂，适用于

通过丝网印刷和注射器分配。125-22设计用于在粘合过程中显示Z小流量。这个产品

在将电路材料与金属背平面和热连接时提供优异的导电性和导热性

下沉。本产品对铜、铝、陶瓷等多种基材具有优异的附着力。

其他应用包括但不限于组装电气和电子部件。这个系统

具有良好的热稳定性和灵活性的形式。

特色

固化过程中的Z小流量低CTE

B-可分级屏幕寿命长

优异的耐化学性优异的高温性能

典型未固化特性

财产价值单位

粘度——布鲁克菲尔德帽子粘度计，

25°C时10转/分20000–30000 cps

比重（水=1）1.88 g/cc

理论覆盖率@0.001“厚度1~30 in2

屏幕寿命>8小时

填充银-

1取决于筛网和材料

典型固化性能

财产价值单位

体积电阻率，0.001Ω-cm

热导率6.5 w/mk

银含量，固化>60-

热稳定性高达325摄氏度

有效温度范围-55至230摄氏度

玻璃化转变温度-TG 150°C

热膨胀系数-低于TG 50 x 10-6 in/in/℃

-高于TG 60 x 10-6英寸/英寸/摄氏度

拉伸剪切强度，Z小2000 psi

剥离强度（90°时铜对铜）9 pli

所有技术信息均基于CMI人员获得的数据，并被认为是可靠的。没有保证是

关于结果或可能侵犯的明示或暗示的。

修订日期：11/12/09修订：A

第2页，共2页

固化指南

温度（摄氏度）时间（分钟）

160 60个

17530个

200 15个

搬运和储存

材料在收到后即可使用。存储冻结以保持一致的流属性。使材料预热

在打开容器前达到室温。在使用之前，重新使用任何固定的填料是很重要的。小心

搅拌时不可截留空气。125-22可以用少量cmi 113-12（快干）或102-03稀释

（慢干）稀释剂。

保质期

储存温度容器B级薄膜

25°C 2个月1个月

-10°C 6个月3个月

B阶段程序

在基材或剥离衬垫上涂上粘合剂。下一步加热以将固化推进到非粘性阶段

冷却到室温。要求温度为100°C至120°C，持续5至15分钟，B级时间为

与质量有关。鼓励用户在给定温度下试验干燥时间。

粘合程序

使用时，在一个零件上涂抹B级粘合剂，小心地对齐要粘合的零件，施加均匀的压力以保持

地点。在200°C下固化15分钟，或在175°C下固化30分钟，或在160°C下固化1小时，以获得更好的粘合效果

薄膜到部分，建议将该部分加热到40°C。给定的固化时间与质量有关，正时

应在粘合剂和基材达到固化温度后开始。

健康与安全

在充分通风的情况下使用。远离火花和明火。避免长时间接触皮肤和

吸入蒸汽。用肥皂和水清洗皮肤。

125-22丝网印刷B级导电低CTE环氧粘合剂

 125-22
SCREEN-PRINTABLE, B-STAGEABLE, ELECTRICALLY CONDUCTIVE, LOW CTE, EPOXY ADHESIVE
DESCRIPTION
125-22 is a screen-printable, B-Stageable, electrically conductive, one part epoxy adhesive, suitable for application
by screen-printing and syringe dispensing. 125-22 is designed to exhibit minimal flow during bonding. This product
provides superior electrical and thermal conductivity when bonding circuit materials to metal back planes and heat
sinks. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates.
Additional applications include, but are not limited to, assembling electrical and electronic components. This system
features excellent thermal stability and flexibility in the B-Staged form.
UNIQUE FEATURES
 Minimal flow during cure  Low CTE
 B-Stageable  Long Screen Life
 Excellent Chemical Resistance  Excellent High Temperature Performance
TYPICAL UNCURED PROPERTIES
Property Value Units
Viscosity – Brookfield HAT Viscometer,
10 rpm @ 25°C 20,000 – 30,000 cps
Specific Gravity (water = 1) 1.88 g/cc
Theoretical Coverage @ 0.001” Thickness1 ~ 30 in2
Screen Life > 8 hrs
Filler Silver -
1 Dependent on screen mesh and material
TYPICAL CURED PROPERTIES
Property Value Units
Volume Resistivity, max 0.001 Ω - cm
Thermal Conductivity 6.5 W/mK
Percent Silver, cured > 60 -
Thermal Stability Good to 325 º C
Useful Temperature Range -55 to 230 º C
Glass transition Temperature – Tg 150 º C
Coefficient of Thermal Expansion - Below Tg 50 x 10-6 in/in/°C
 - Above Tg 60 x 10-6 in/in/°C
Tensile Shear Strength, min 2000 Psi
Peel Strength (Copper to copper @ 90°) 9 Pli
All technical information is based on data obtained by CMI personnel and is believed to be reliable. No warranty is
either expressed or implied with respect to results or possible infringements on patents.
REVISION DATE: 11/12/09 REVISION: A
Page 2 of 2
CURING GUIDELINES
Temperature (ºC) Time (min.)
 160 60
 175 30
 200 15
HANDLING AND STORAGE
Material is ready to use as received. Store frozen to maintain consistent flow properties. Allow material to warm up
to room temperature before opening container. It is important to resuspend any settled filler before using. Be careful
not entrap air while mixing. 125-22 can be thinned with small amounts of CMI# 113-12 (fast drying), or #102-03
(slow drying) thinners.
 SHELF LIFE
Storage Temperature Containers B-Staged Film
 25°C 2 months 1 month
-10°C 6 months 3 months
B-STAGE PROCEDURE
Apply adhesive to substrate or release liner. Next apply heat to advance the curing to the non-tacky stage when
cooled to room temperature. A temperature of 100°C to 120°C for 5 to 15 minutes is required, B-Stage time is
mass related. User is encouraged to experiment for optimum drying time at a given temperature.
BONDING PROCEDURE
To use, apply b-staged adhesive to one part, carefully align parts to be bonded, apply uniform pressure to maintain
location. Cure for 15 minutes at 200°C, or 30 minutes at 175°C, or 1 hour at 160°C. For better adhesion of the bstaged
film to the first part, it is suggested to warm the part to 40°C. Cure times given are mass related, timing
should start after adhesive and substrates reach curing temperature.
HEALTH AND SAFETY
Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and
breathing of vapors. Wash with soap and water to remove from skin.